論文
公開件数:61件
No. 種別 査読の有無 標題 単著・共著区分 著者 誌名 巻号頁 出版日 ISSN DOI URL
1 一般論文

Seven View Points and Reliability Engineering Scheme for Preventing Reliability Problems
共著
Kazuyuki Suzuki, Shinji Yokogawa
International Journal of Reliability, Quality and Safety Engineering
26/ 6, 2050006-1-2050006-17
2019/09/13

https://doi.org/10.1142/S0218539320500060

2 一般論文

Liner- and barrier-free NiAl metallization: A perspective from TDDB reliability and interface status
共著
Linghan Chen, Daisuke Ando, Yuji Sutou, Shinji Yokogawa, Junichi Koike
Applied Surface Science
497/ 15, 143810-1-143810-5
2019/08/27

https://doi.org/10.1016/j.apsusc.2019.143810

3 一般論文

Bayesian inference of a lifetime distribution parameter on the time-dependent dielectric breakdown with clustering defects
共著
Kyosuke Kunii, Shun Endo and Shinji Yokogawa
Japanese Journal of Applied Physics
58/ SH, SHHG02-1-SHHG02-8
2019/07/05



4 一般論文

グラフ列挙による風力・太陽光・蓄電池複合システムの重複グルーピング最適化
共著
武田健吾, 澤田 賢治, 横川 慎二, 新誠一
電気学会論文誌C
139/ 7, 786-795
2019/07/01



5 一般論文

機能共鳴分析法を用いた自動車リコール情報の可視化に基づく創発的不具合の構造解析
単著
横川慎二
日本信頼性学会誌
41, 135-147
2019/03/01



6 一般論文

Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations
共著
Ploybussara Gomasang, Satoru Ogiue, Shinji Yokogawa and Kazuyoshi Ueno
Japanese Journal of Applied Physics
58/ SB, SBBC01-1-SBBC01-6
2019/02/22



7 一般論文

風力・太陽光・蓄電池複合システムの重複分散運用の検討
共著
武田健吾, 澤田 賢治, 横川 慎二, 新誠一
電気学会論文誌C
138/ 12, 1554-1565
2018/12/01



8 一般論文

A statistical evaluation method for lifetime distribution in field accelerated time-dependent dielectric breakdwon by using two-step probability plot and multi-link test scheme
共著
K. Tate and S. Yokogawa
Japanese Journal of Applied Physics
57/ 7S2
2018/05/21



9 一般論文

A survey of critical failure events in on-chip interconnect by using fault tree analysis
共著
S. Yokogawa, K. Kunii
Japanese Journal of Applied Physics
57/ 7S2
2018/05/21



10 一般論文

Two-step probability plot for parameter estimation of lifetime distribution affected by defect clustering in time-dependent dielectric breakdown
単著
Shinji Yokogawa
Japanese Journal of Applied Physics
56
2017/07



11 一般論文

トラブル予測表を用いた故障モード予測方法と信頼性・安全性の作りこみ評価指標の提案
共著
山﨑雄大, 横川慎二, 鈴木和幸
日本信頼性学会誌
38/ 4, 271-283
2016/07



12 一般論文

A simulation study for lifetime distribution of time-dependent dielectric breakdown in middle-of-line affected by global and local space variations
単著
Shinji Yokogawa
Japanese Journal of Applied Physics
55, 06JF02-1-06JF02-6
2016/05/17

10.7567/JJAP.55.06JF02

13 一般論文

Statistical characteristics of lifetime distribution based on defect clustering for time-dependent dielectric breakdown in middle-and back-end-of-line
単著
Yokogawa, Shinji
JAPANESE JOURNAL OF APPLIED PHYSICS
54/ 5
2015/05
0021-4922
10.7567/JJAP.54.05EC02

14 一般論文

Lifetime prediction model of stress-induced voiding in Cu/low-kappa interconnects
単著
Yokogawa, Shinji
JAPANESE JOURNAL OF APPLIED PHYSICS
53/ 5, 216-221
2014/05
0021-4922
10.7567/JJAP.53.05GA03

15 一般論文

Highly reliable molecular-pore-stacking (MPS)/Cu interconnects featuring best combination of post-etching treatment and resputtering processes
共著
Oshida, Daisuke, Kume, Ippei, Katsuyama, Hirokazu, Ueki, Makoto, Iguchi, Manabu, Yokogawa, Shinji, Inoue, Naoya, Oda, Noriaki, Sakurai, Michio
MICROELECTRONIC ENGINEERING
118, 72-78
2014/04
0167-9317
10.1016/j.mee.2013.12.007

16 一般論文

Moisture Absorption Impact on Cu-alloy/low-k Reliability during Process Queue Time
共著
H. Tsuchiya, S. Yokogawa, H. Kunishima, T. Kuwajima, T. Usami, Y. Miura, K. Ohto, K. Fujii, and M. Sakurai
Microelectronics Engineering
106, 205-209
2013



17 一般論文

Highly reliable enhanced nitride interface process of barrier low-k using ultra-thin SiN with moisture blocking capability
共著
Usami, Tatsuya, Miura, Yukio, Nakamura, Tomoyuki, Tsuchiya, Hideaki, Kobayashi, Chikako, Ohto, Koichi, Hiroshima, Shoichi, Tanaka, Mikio, Kunishima, Hiroyuki, Ishizuka, Issei, Kuwajima, Teruhiro, Sakurai, Michio, Yokogawa, Shinji, Fujii, Kunihiro
MICROELECTRONIC ENGINEERING
112, 97-102
2013/12
0167-9317
10.1016/j.mee.2013.02.058

18 一般論文

Lifetime Distribution Analysis of Stress-Induced Voiding Based on Void Nucleation and Growth in Cu/Low-kappa Interconnects
共著
Yokogawa, Shinji, Tsuchiya, Hideaki
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
13/ 1, 272-276
2013/03
1530-4388
10.1109/TDMR.2013.2237775

19 一般論文

Thermal Transient Response and Its Modeling for Joule Heating in Cu/Low-kappa Interconnects Under Pulsed Current
共著
Yokogawa, Shinji, Tsuchiya, Hideaki, Shimizu, Tatsuo
JAPANESE JOURNAL OF APPLIED PHYSICS
51/ 5, 350-357
2012/05
0021-4922
10.1143/JJAP.51.05EC06

20 一般論文

Failure analysis of fine Cu patterning by shave-off profiling

M. Nojima, M. Fujii, Y. Kakuhara, H. Tsuchiya, A. Kameyama, S. Yokogawa, M. Owari and Y. Nihei
Surface and Interface Analysis
43, 621-624
2011



21 一般論文

Role of Impurity Segregation into Cu/Cap Interface and Grain Boundary in Resistivity and Electromigration of Cu/Low-k Interconnects
共著
Yokogawa, Shinji, Kakuhara, Yumi
JAPANESE JOURNAL OF APPLIED PHYSICS
50/ 5
2011/05
0021-4922
10.1143/JJAP.50.05EA02

22 一般論文

Comparison of Lifetime Improvements in Electromigration between Ti Barrier Metal and Chemical Vapor Deposition Co Capping
共著
Kakuhara, Yumi, Yokogawa, Shinji, Ueno, Kazuyoshi
JAPANESE JOURNAL OF APPLIED PHYSICS
49/ 4
2010
0021-4922
10.1143/JJAP.49.04DB08

23 一般論文

Statistical Analysis of Lifetime Distribution of Time-Dependent Dielectric Breakdown in Cu/Low-k Interconnects by Incorporation of Overlay Error Model
共著
Yokogawa, Shinji, Tsuchiya, Hideaki
JAPANESE JOURNAL OF APPLIED PHYSICS
49/ 5
2010/05
0021-4922
10.1143/JJAP.49.05FE01

24 一般論文

Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dummy Metal
共著
Kakuhara, Yumi, Yokogawa, Shinji, Hiroi, Masayuki, Takewaki, Toshiyuki, Ueno, Kazuyoshi
JAPANESE JOURNAL OF APPLIED PHYSICS
48/ 9
2009/09
0021-4922
10.1143/JJAP.48.096504

25 一般論文

Analysis of Al doping effects on resistivity and electromigration of copper interconnects

Yokogawa, Shinji, Tsuchiya, Hideaki, Kakuhara, Yumi, Kikuta, Kuniko
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
8/ 1, 216-221
2008/03
1530-4388
10.1109/TDMR.2007.915003

26 一般論文

Tradeoff characteristics between resistivity and reliability for scaled-down Cu-based interconnects
共著
Yokogawa, Shinji, Kikuta, Kuniko, Tsuchiya, Hideaki, Takewaki, Toshiyuki, Suzuki, Mieko, Toyoshima, Hironori, Kakuhara, Yumi, Kawahara, Naoyoshi, Usami, Tatsuya, Ohto, Koichi, Fujii, Kunihiro, Tsuchiya, Yasuaki, Arita, Koji, Motoyama, Koichi, Tohara, Makoto, Taiji, Toshiji, Kurokawa, Tetsuya, Sekine, Makoto
IEEE TRANSACTIONS ON ELECTRON DEVICES
55/ 1, 350-357
2008/01
0018-9383
10.1109/TED.2007.910619

27 一般論文

A Robust Embedded Ladder-oxide/Cu Multilevel Interconnect Technology for 0.13μm Complementary Metal Oxide Semiconductor Generation

N. Oda, S. Ito, T. Takewaki, K. Shiba, H. Kunishima, N. Hironaga, I. Honma, H. Namba, S. Yokogawa, A. Kameyama, T. Goto, T. Usami, K. Ohto, A. Kubo, M. Suzuki, Y. Yamamoto, S. Watanabe, K. Yamada, M. Ikeda, K. Ueno, and T.Horiuchi
JAPANESE JOURNAL OF APPLIED PHYSICS
46/ 3A, 954-961
2007



28 一般論文

Effects of Al doping on the electromigration performance of damascene Cu interconnects
共著
Yokogawa, Shinji, Tsuchiya, Hideaki
JOURNAL OF APPLIED PHYSICS
101/ 1
2007/01
0021-8979
10.1063/1.2405739

29 一般論文

Electromigration lifetimes and void growth at low cumulative failure probability
共著
Tsuchiya, Hideaki, Yokogawa, Shinji
MICROELECTRONICS RELIABILITY
46/ 9-11, 1415-1420
2006/01
0026-2714
10.1016/j.microrel.2006.08.001

30 一般論文

シングルダマシンCu配線におけるパルス電流下のエレクトロマイグレーション挙動
単著
横川慎二
電子情報通信学会誌
88-C/ 4, 253-260
2005



31 一般論文

Scaling Impacts on Electromigration in Narrow Single-Damascene Cu Interconnects

Yokogawa, Shinji, Tsuchiya, Hideaki
JAPANESE JOURNAL OF APPLIED PHYSICS
44/ 4A, 1717-1721
2005



32 一般論文

Electromigration-Induced Void Growth Kinetics in SiNx passivated Single-Damascene Cu Lines
単著
Yokogawa, Shinji
JAPANESE JOURNAL OF APPLIED PHYSICS
43/ 9A, 5990-5996
2004



33 一般論文

サドンデスTEGとOBIRCHを用いたダマシンCu配線のエレクトロマイグレーション評価
単著
横川慎二
日本信頼性学会誌
25/ 8, 811-820
2003



34 一般論文

Electromigration Performance of Multi-level Damascene Copper Interconnects

Yokogawa, Shinji, Norio, Okada, Yumi, Kakuhara, Hideyuki, Takizawa
Microelectronics Reliability
41, 1409-1416
2001



35 一般論文

劣化量データを用いた寿命特性推定法に関する一考察 -拡散の故障メカニズムに基づく場合-
共著
鈴木和幸、真木浩司、横川慎二
日本信頼性学会誌
15/ 2, 6-13
1993



36 一般論文

劣化量データを用いた設備の最適保全方策とパラメータ推定
共著
横川慎二、鈴木和幸
日本設備管理学会誌
5/ 3, 3-12
1993



37 国際会議プロシーディングス等

A Simple Prediction Method for Chip-level Electromigration Lifetime using Generalized Gamma Distribution
共著
S. Yokogawa and K. Kunii
2019 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM
P.MB.9-1-P.MB.9-6
2019



38 国際会議プロシーディングス等

Reliability Evaluation of Defect Accounted Time-Dependent Dielectric Breakdown with Competing-Mixture Distribution

S. Yokogawa and K. Tate
2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM
P-GD.2-1-P-GD.2-4
2018



39 国際会議プロシーディングス等

Impacts of Censoring on Lifetime Analysis by 2-step Probability Plot in Defect Clustered TDDB

Yokogawa, Shinji
2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM
DG3-1-DG3-6
2017



40 国際会議プロシーディングス等

Middle of Line (MOL) Reliability –in between FEOL and BEOL-
単著
Yokogawa, Shinji
International Reliability Physics Symposium
S1.3, 1-76
2015



41 国際会議プロシーディングス等

Lifetime Prediction for Stress-induced Voiding in Nose-shape Lines by using a Stress-diffusion Analytical Model

Yokogawa, Shinji
2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM
97-102
2014
1541-7026


42 国際会議プロシーディングス等

Statistics of Breakdown Field and Time-Dependent Dielectric Breakdown in Contact-to-Poly Modules
共著
Yokogawa, Shinji, Uno, Satoshi, Kato, Ichiro, Tsuchiya, Hideaki, Shimizu, Tastuo, Sakamoto, Mitsuhiro
2011 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)
350-357
2011



43 国際会議プロシーディングス等

Effective Thermal Characteristics to Suppress Joule Heating Impacts on Electromigration in Cu/Low-k Interconnects
共著
S. Yokogawa, H. Tsuchiya, and Y. Kakuhara
International Reliability Physics Symposium
717-723
2010



44 国際会議プロシーディングス等

Direct Observation of RTN-induced SRAM Failure by Accelerated Testing and Its Application to Product Reliability Assessment
共著
K. Takeuchi, T. Nagumo, K. Takeda, S. Asayama, S. Yokogawa, K. Imai and Y. Hayashi
2010 Symp. on VLSI Tech. Dieg. of Tech. Papers
189-190
2010



45 国際会議プロシーディングス等

Joule heating Effects on Electromigration in Cu/Low-k Interconnects
共著
S. Yokogawa, Y. Kakuhara, and H. Tsuchiya
International Reliability Physics Symposium
837-843
2009



46 国際会議プロシーディングス等

Vth Fluctuations due to Random Telegraph Signal on Work Function Control in Hf-doped Silicate Gate Stack
共著
T. Shimizu, I. Kato, T. Kitagaki, J. Taniguchi, T. Suzuki, T. Tsuboi, and S. Yokogawa
International Reliability Physics Symposium
389-394
2009



47 国際会議プロシーディングス等

Single-Charge-Based Modeling of Transistor Characteristics Fluctuations Based on Statistical Measurement of RTN Amplitude
共著
K. Takeuchi, T. Nagumo, S. Yokogawa, K. Imai and Y. Hayashi
2009 Symp. on VLSI Tech. Dieg. of Tech. Papers
54-55
2009



48 国際会議プロシーディングス等

Optimization of Metallization Processes for 32-nm-node Highly Reliable Ultralow-k (k=2.4)/Cu Multilevel Interconnects Incorporating a Bilayer Low-k Barrier Cap (k=3.9)
共著
M. Iguchi, S. Yokogawa, H. Aizawa, Y. Kakuhara, H. Tsuchiya, N. Okada, K. Imai, M. Tohara, K. Fujii, T. Watanabe
International Electron Device Meeting
36.1.1-36.1.4
2009



49 国際会議プロシーディングス等

New Analysis Methods for Comprehensive Understanding of Random Telegraph Noise
共著
T. Nagumo, K. Takeuchi, S. Yokogawa, K. Imai, and Y. Hayashi
International Electron Device Meeting
32.1.1-32.1.4
2009



50 国際会議プロシーディングス等

Prediction of Early Failure Due to Non-visual Defect on Time-Dependent Dielectric Breakdown of Low-k Dielectrics: Experimental Verification of a Yield-Reliability Model
共著
S. Yokogawa, D. Oshida, H. Tsuchiya, T. Taiji, T. Morita, Y. Tsuchiya, and T. Takewaki
International Reliability Physics Symposium
144-149
2008



51 国際会議プロシーディングス等

Analytical Study of Impurity Doping Effects on Electromigration of Cu Interconnects by Employing Comprehensive Scattering Model
共著
S. Yokogawa, Y. Kakuhara, H. Tsuchiya, and K. Kikuta
International Reliability Physics Symposium
117-121
2007



52 国際会議プロシーディングス等

Impurity doping effects on electromigration performance of scaled-down Cu interconnects
共著
Yokogawa, Shinji, Tsuchiya, Hideaki
STRESS-INDUCED PHENOMENA IN METALLIZATION
945, 82-97
2007
0094-243X


53 国際会議プロシーディングス等

Effects of Al Doping on Electromigration Performance of Narrow Single Damascene Cu Interconnects
共著
Yokogawa, Shinji, Tsuchiya, Hideaki
International Reliability Physics Symposium
667-668
2006



54 国際会議プロシーディングス等

A Novel Resistivity Measurement Technique for Scaled-down Cu Interconnects Implemented to Reliability-focused Automobile Applications
共著
S. Yokogawa, K. Kikuta, H. Tsuchiya, T. Takewaki, M. Suzuki, H. Toyoshima, Y. Kakuhara, N. Kawahara, T. Usami, K. Ohto, K. Fujii, Y. Tsuchiya, K. Arita, K. Motoyama, M. Tohara, T. Taiji, T. Kurokawa, and M. Sekine
International Electron Device Meeting
85-88
2006



55 国際会議プロシーディングス等

A Robust Embedded Ladder-oxide/Cu Multilevel Interconnect Technology for 0.13μm CMOS Generation
共著
N. Oda, S. Ito, T. Takewaki, H. Kunishima, N. Hironaga, I. Honma, N. Namba, S. Yokogawa, T. Goto, T. Usami, K. Ohto, A. Kubo, H. Aoki, M. Suzuki, Y. Yamamoto, S. Watanabe, T. Takeda, K. Yamada, M. Kosaka and T. Horiuchi
2002 Symp. on VLSI Tech. Dieg. of Tech. Papers
34-35
2002



56 国際会議プロシーディングス等

Full-0.56μm Pitch Copper Interconnects for a High Performance 0.15-μm CMOS Logic Device
共著
M. Iguchi, T. Takewaki, Y. Matsubara, Y. Kunimune, N. Ito, Y. Tsuchiya, T. Matsui, K. Fujii, K. Motoyama, K. Sugai, A. Kubo, M. Suzuki, H. Tachibana, A. Nishizawa, K. Nakabeppu, S. Yamasaki, S. Yokogawa, Y. Yamamoto, T. Kunugi, S. Nakata, M. Kagamihara, A. Shida, S. Nakamoto and H. Gomi
International Electron Device Meeting
615-618
1999



57 国際会議プロシーディングス等

An Analysis of Degradation Data of a Carbon Film and the Properties of the Estimators
共著
Suzuki, Kazuyuki, Koji, Maki, Shinji, Yokogawa
Stat. Sci. and Data Anal.
501-511
1993



58 解説

深層学習・深層強化学習を応用したエネルギーシステムの最適化
共著
曽我部東馬, 横川慎二
日本信頼性学会誌
40, 87-93
2018/01/01



59 解説

再生可能エネルギー指向自律分散グリッドーバーチャルグリッドー
共著
横川慎二,市川晴久,曽我部東馬,澤田賢治,川喜田佑介
日本信頼性学会誌
39, 8-15
2017/01/01



60 解説

コンタクトの信頼性 ―Siデバイスから先端パワーデバイスまで―
単著
横川慎二
日本信頼性学会誌
37, 26-33
2015/01/01



61 論説

社会インフラの事故・不具合の未然防止における視点
単著
横川慎二
品質
47, 15-20
2017/01/01